W1siziisimnvbxbpbgvkx3rozw1lx2fzc2v0cy9tb3jzb24vanbnl2jhbm5lci1kzwzhdwx0ltmuanbnil1d

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Senior Processing Manager

  • Location

    München (81249), Bayern

  • Sector:

    Telecoms

  • Job type:

    Permanent

  • Salary:

    Up to £0.00 per annum

  • Contact:

    Sarah Yan

  • Contact email:

    Sarah.Yan@morson.com

  • Job ref:

    143183SY_1527688014

  • Published:

    3 months ago

  • Expiry date:

    2018-06-06

  • Start date:

    ASAP

  • Client:

    #

Responsibilities:
Definition of DOE in alignment with NPI and Quality and Execution
Management of PE-Projects (scope, time & budget)
Process development and process verification in field of semiconductor packaging (back end)
Enablement of new technologies for future design of our COB/CSP devices and modules
Creation and alignment of technical design guide lines (DFx, SOW)
Process optimization from both directions: shopfloor (SPC/LEAN/QC) & system level (SLE)
Strategic planning with dep. Quality & NPI and Products lines (road map)

Requirements on Skills, Qualifications and Experience:
University/ University of Applied Science degree in relevant technical domains
5+ years of experience in processing engineering in semiconductor companies
Strong communication skills, interest in co-ordination of activities in x-functional teams
Trainings & certifications in i.e. Project Management/Quality Control/ Six Sigma (GB/BB) are a plus
Clear understanding of process-/product maturity, including involved quality procedures
Practical experience in semiconductor packaging technologies (die attach/ flip-chip/ intermetallic bonding/ moulding)
Experience in advanced process data tracking (MES, Smart Process Engineering
International horizon & strong ability for team work in multi-disciplinary set-ups is a priority
German or English C2, English or German B2