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Process Engineering Expert

  • Location

    Germany, Germany

  • Sector:

    Telecoms

  • Job type:

    Permanent

  • Salary:

    Up to £0.00 per annum

  • Contact:

    Sarah Yan

  • Contact email:

    Sarah.Yan@morson.com

  • Job ref:

    156544SY_1548842488

  • Published:

    3 months ago

  • Expiry date:

    2019-03-27

  • Start date:

    ASAP

  • Client:

    #

Your focus will be on:
* Lead the team and drive for benchmark results
* Definition and execution of DOEs in alignment with the Advanced Package Technology and Quality team
* Management of PE-Projects (scope, time & budget)
* Process development and process verification in field of semiconductor packaging (back end)
* Enablement of new technologies for future designs of our COB/ CSP devices and modules
* Creation and alignment of technical design guide lines (DFx, SOW, …)
* Process optimization from both directions: shopfloor (SPC/ LEAN/ QC) & system level (SLE)
* Strategic planning in alignment with all relevant departments (roadmap)
* Drive process setup with respect to smooth manufacturing

These skills will help you to perform the role:
* University / University of Applied Science degree in relevant technical domains
* 5+ years of experience in process engineering / production in semiconductor companies
* Experience in leading a team of engineers, technicians and/or operators
* Strong communication skills, interest in coordination of activities in x-functional teams
* Trainings & certifications in i.e. Project Management/ Quality Control/ Six Sigma (GB / BB) are a plus
* Clear understanding of process-/ product maturity, including involved quality procedures
* Practical experience in semiconductor packaging technologies (die attach/ flip-chip/ intermetallic bonding/ molding/ …)
* Experience in advanced process data tracking (MES, Smart Process Engineering)
* International horizon & strong ability for team work in multidisciplinary set-ups is a priority
* German OR English C2, English or German B2